Development of insulated Cu wire ball bonding

• 主要な著者: Leong, H.Y., Mohd, F.Z., Ibrahim, M.R., Kid, W.B., Khan, N., Kar, Y.B., Tan, L.C.
• 出版事項: 2018
• オンライン･アクセス: http://dspace.uniten.edu.my/jspui/handle/123456789/8798

Insulated Cu wire is the next generation technology in fine pitch and high density wire bonding, which enables wire crossing and touching without concern for wire-to-wire shorts. However, insulated Cu wire bonding is still at the infant stage compared to Cu wire bonding. This study investigates the...