Characterization study for polymer core solder balls under AC and TC reliability test
Since Restriction of Hazardous Substance (RoHS) Regulation came into effect in year 2006 due to the hazardous effects of lead to human's health and toxicity for environment, Ball Grid Array (BGA) semiconductor chip are widely used for many electronic applications including portable, automotive...
保存先:
| 主要な著者: | , , |
|---|---|
| フォーマット: | |
| 出版事項: |
2018
|
| オンライン･アクセス: | http://dspace.uniten.edu.my/jspui/handle/123456789/8772 |
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|