Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize thermomechanical failure mechanism on microelectronics package. This research...
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| Format: | Thesis |
| Language: | English |
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Universiti Malaysia Perlis
2010
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| Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/9878 |
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