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Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize thermomechanical failure mechanism on microelectronics package. This research...

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書目詳細資料
主要作者:	Muhammad Nubli, Zulkifli
格式:	Thesis
語言:	English
出版:	Universiti Malaysia Perlis 2010
主題:	Microelectronic package Temperature cycling Solder joint fatigue life Thermal cycling test Ball grid array (BGA) Finite elements analysis (FEA)
在線閱讀:	http://dspace.unimap.edu.my/xmlui/handle/123456789/9878
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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