Temperature cycling test for a Ball Grid Array (BGA) package using finite element analysis (FEA)
Master of Science (Microelectronic Engineering)
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| Format: | Thesis |
| Language: | English |
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Universiti Malaysia Perlis (UniMAP)
2019
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| Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63441 |
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