Holdings: Temperature cycling analysis for ball grid array package using finite element analysis

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Bibliographic Details
Main Authors:	Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Dato, Prof. Dr., Ghulam, Abdul Quadir, Prof. Dr.
Other Authors:	zulazhar@unimap.edu.my
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2014
Subjects:	Finite element analysis Joining processes Soldering Stress (materials) Surface fitting
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33940
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