Reduction of warpage occurrence on stack-die QFN using FEA and statistical method

• Main Authors: Abdullah I., Ahmad I., Talib M.Z.M., Kamarudin M.N.B.C.
• Other Authors: 24721493100
• Format: Conference paper
• Published: 2023
• Subjects: Dies; Finite element method; Optimization; Packaging; Probability density function; Statistics; Structural analysis; Coefficient of thermal expansion; CTE property; Experimental data; Matrix arrays; Molding compound; Optimal combination; Optimum combination; Package geometries; Passive components; QFN package; Thermal mismatch; Thermal properties; Warpages; Thermal expansion

Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in...