Muhammad Nubli, Z. (2010). Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA). Universiti Malaysia Perlis.
Chicago Style CitationMuhammad Nubli, Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA). Universiti Malaysia Perlis, 2010.
MLA CitationMuhammad Nubli, Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA). Universiti Malaysia Perlis, 2010.
Warning: These citations may not always be 100% accurate.