Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition

• المؤلفون الرئيسيون: Harif M.N., Ahmad I.
• مؤلفون آخرون: 22634024000
• التنسيق: Conference paper
• منشور في: 2023
• الموضوعات: Lead free; Pull test and IMC thicknesses; Solder joint; Chip scale packages; Intermetallics; Materials; Mechanical properties; Semiconductor growth; Silver; Soldering alloys; Spheres; Testing; Thermoelectric equipment; Units of measurement; After high temperature; High temperature storage; High-power; Image analyzers; IMC thickness; Intermetallic compounds; Intermetallic thickness; Joint effect; Joint reliability; Joint strength; Lead-Free; Lead-free solder joint; Per unit; Pull strength; Sample sizes; Semiconductor packaging; Sn-3.5Ag; Sn3.5Ag solder; Solder joints; Solder-joint strength; Statistical analysis; Test data; Test machine; Test method; Test results; Thermal condition; Thermal condition tests; Lead

The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were sele...