A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

• Main Authors: Amin N., Lim V., Seng F.C., Razid R., Ahmad I.
• Other Authors: 7102424614
• Format: Article
• Published: 2023
• Subjects: Copper; Electric batteries; Electronics packaging; Flip chip devices; Heating equipment; Mixed convection; Nickel; Nickel alloys; Surface roughness; Thermal conductivity; Thermal diffusion; Activation techniques; After high temperatures; Catalytic activations; Copper heat spreaders; Copper layers; Copper strikes; Flip chips; Flip-chip ball grid arrays; Heat spreaders; High temperature storage tests; Initial time; Intermetallic diffusions; Low thermal conductivities; Practical investigations; Semiconductor packages; Thermal performance; Spreaders

This study investigates the effects of two different catalytic activation techniques on the thermal performance of the flip-chip heat spreaders. The two activation techniques studied are thin nickel-copper strike and galvanic initiation. Thermal diffusivity and surface roughness of these heat spread...