Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize thermomechanical failure mechanism on microelectronics package. This research...

Full description

Saved in:
Bibliographic Details
Main Author: Muhammad Nubli, Zulkifli
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/9878
Tags: Add Tag
No Tags, Be the first to tag this record!