Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

• Main Author: Muhammad Nubli, Zulkifli
• Format: Thesis
• Language: English
• Published: Universiti Malaysia Perlis 2010
• Subjects: Microelectronic package; Temperature cycling; Solder joint fatigue life; Thermal cycling test; Ball grid array (BGA); Finite elements analysis (FEA)
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/9878

Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize thermomechanical failure mechanism on microelectronics package. This research...