Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Electrochemical Society
2010
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| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/7463 |
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