Comments: Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad

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Bibliographic Details
Main Authors:	Mohd Khairuddin, Md Arshad, Lim, Moy Fung, Uda, Hashim, Zaliman, Sauli
Format:	Article
Language:	English
Published:	The Electrochemical Society 2010
Subjects:	Intermetallic growth Thermal aging Wire bonding Field emission Semiconductor materials Aluminum Light metals
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/7463
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