Holdings: Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor

Master of Science Microelectronic System Design Engineering

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Bibliographic Details
Main Author:	Ong, Chiew Yeong
Other Authors:	Vithyacharan, Retnasamy, Dr.
Format:	Thesis
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2018
Subjects:	Insulated gate bipolar transistors Bipolar transistors Wire bonding (Electronic packaging) Planar transistors
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77429
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