Mohd Khairuddin, M. A. (2010). Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad. The Electrochemical Society.
Chicago Style CitationMohd Khairuddin, Md Arshad. Thermal Aging Study At 150 °C and 200 °C: Gold Ball Bonds to Aluminum Bond Pad. The Electrochemical Society, 2010.
MLA CitationMohd Khairuddin, Md Arshad. Thermal Aging Study At 150 °C and 200 °C: Gold Ball Bonds to Aluminum Bond Pad. The Electrochemical Society, 2010.
Warning: These citations may not always be 100% accurate.