Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology

• Main Authors: Nor N.H.M., Taib S., Ahmad I., Abdullah H.
• Other Authors: 57219925855
• Format: Conference paper
• Published: 2023
• Subjects: Capillarity; Electric batteries; Electronics packaging; Electroplating; Energy transfer; High temperature superconductors; Lead compounds; Lead plating; Metallic compounds; Morphology; Surface analysis; Wire; After high temperature; Bond quality; Cross-section analysis; Energy transfer efficiency; Equipment efficiency; Higher yield; Inter-layers; Mechanical interlocking; New design; Physical inspection; Production yield; Relative displacement; SEM image; Statistical analysis; Thermal cycle; Ultra fine pitch; Wire bonding; Wire bonds; Surface morphology

Wire bonding of 20micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality an...