Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves s...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Elsevier
2020
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/25376/ https://doi.org/10.1016/j.matlet.2019.126833 |
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