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Experimental investigation on material migration phenomena in micro-EDM of reaction-bonded silicon carbide

Material migration between tool electrode and workpiece material in micro electrical discharge machining of reaction-bonded silicon carbide was experimentally investigated. The microstructural changes of workpiece and tungsten tool electrode were examined using scanning electron microscopy, cross se...

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Bibliographic Details
Main Authors: Liew , Pay Jun, Yan , Jiwang, Kuriyagawa, Tsunemoto
Format: Article
Language:English
Published: Elsevier 2013
Subjects:
TJ Mechanical engineering and machinery
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/10916/1/Experimental_investigation_on_material_migration_phenomena_in_micro-EDM_of_reaction-bonded_silicon_carbide.pdf
http://eprints.utem.edu.my/id/eprint/10916/
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http://eprints.utem.edu.my/id/eprint/10916/1/Experimental_investigation_on_material_migration_phenomena_in_micro-EDM_of_reaction-bonded_silicon_carbide.pdf
http://eprints.utem.edu.my/id/eprint/10916/

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