Application of laser heating and its effects on bonding strengths for varied copper wire purity levels
Gold as the medium of interconnection is rapidly being replaced by copper as a means of creating connectivity in integrated circuit packaging. However, the use of copper wire is known to pose many threats in integrated circuit packaging, especially for devices with very thin die structures. The proc...
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| Main Authors: | , |
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| Format: | Article |
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Laser Institute of America
2018
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| Online Access: | http://eprints.um.edu.my/20654/ https://doi.org/10.2351/1.5008639 |
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