Wire sweep improvement study of multi-tier palladium-copper wire bonding on low-quad flat package using low-alpha green mould compound
In this paper, a short-shot mould study is performed on device M in order to understand the mould-filling patterns during mould encapsulation. The wire sweep performance is evaluated for two die thicknesses, wire loop heights and various moulding compounds. Moreover, the actual length of worst swept...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Published: |
Springer Verlag (Germany)
2014
|
| Subjects: | |
| Online Access: | http://eprints.um.edu.my/15467/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|