Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding
Low cost, high reliable and robust semiconductor packages are required in order for semiconductor manufacturer to stay competitive in the industry. This requires a stable manufacturing process that able to maintain high production yield, reduce customer reject and scrap cost. Currently, combination...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English English |
| Published: |
2016
|
| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/18372/1/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf http://eprints.utem.edu.my/id/eprint/18372/2/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf http://eprints.utem.edu.my/id/eprint/18372/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=100166 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Internet
http://eprints.utem.edu.my/id/eprint/18372/1/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdfhttp://eprints.utem.edu.my/id/eprint/18372/2/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf
http://eprints.utem.edu.my/id/eprint/18372/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=100166