Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish

The growth of an intermetallic compound (IMC) can influence the behavior of solder joints. In this study, the different percentages of Ag in Sn-xAg (value x = 2.5 and 3.5 wt.%) solder alloy were involved along with ENImAg surface finish to reveal the solder joints reliability in term of IMC thicknes...

Full description

Saved in:
Bibliographic Details
Main Authors: Mohamed Anuar, Rabiatul Adawiyah, Hamidin, Mohamad Shahrom, Osman, Saliza Azlina, Othman, Mohamad Hilmi
Format: Article
Language:English
Published: WARSE 2020
Subjects:
Online Access:http://eprints.uthm.edu.my/6341/1/AJ%202020%20%28818%29.pdf
http://eprints.uthm.edu.my/6341/
https://doi.org/10.30534/ijeter/2020/0881.22020
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items