A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish

As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb-free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabri...

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Bibliographic Details
Main Authors: Leng, E.P., Ding, M., Rayos, J., Ahmad, I., Jalar, A., Qiang, C.C.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5292
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