A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish

• Main Authors: Leng, E.P., Ding, M., Rayos, J., Ahmad, I., Jalar, A., Qiang, C.C.
• Published: 2017
• Online Access: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5292

As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb-free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabri...