Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader
This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. Electroless nickel plating is used as a plating technique as it can form a uniform thickness of nickel layer onto the copper substrate. Catalytic activation proces...
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| Main Authors: | , , , , , , |
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| Format: | |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5243 |
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