Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package
This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. The two activation techniques investigated are i) thin nickel-copper strike and ii) galvanic initiation. Thermal diffusivity of these heat spreaders was studied us...
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| 主要な著者: | , , , , |
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2017
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| オンライン･アクセス: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5276 |
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