New Design of Heat Spreader for Semiconductor Device
The objective of this project is to improve the heat removal efficiency of heat spreader by replacing the currently used material with copper-carbon composite. Thermal conductivity and coefficient of thermal expansion are parameters that must be considered to select a good material for heat spreader...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
Universiti Teknologi Petronas
2008
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| Online Access: | http://utpedia.utp.edu.my/631/1/3._body.pdf http://utpedia.utp.edu.my/631/ |
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