A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

• المؤلفون الرئيسيون: Amin, N., Lim, V., Seng, F.C., Razid, R., Ahmad, I.
• منشور في: 2017
• الوصول للمادة أونلاين: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5260

This study investigates the effects of two different catalytic activation techniques on the thermal performance of the flip-chip heat spreaders. The two activation techniques studied are thin nickel-copper strike and galvanic initiation. Thermal diffusivity and surface roughness of these heat spread...