Mold filling parameters in resin transfer molding for flip chip semiconductor packages

• Main Author: Lim, Ming Siong
• Format: Thesis
• Language: English; English
• Published: 2017
• Subjects: T Technology (General); TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utem.edu.my/id/eprint/22475/1/Mold%20Filling%20Parameters%20In%20Resin%20Transfer%20Molding%20For%20Flip%20Chip%20Semiconductor%20Packages.pdf; http://eprints.utem.edu.my/id/eprint/22475/2/Mold%20filling%20parameters%20in%20resin%20transfer%20molding%20for%20flip%20chip%20semiconductor%20packages.pdf; http://eprints.utem.edu.my/id/eprint/22475/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109156

Flip chip technology is always been the preferred option for semiconductor packaging technology due to its advantages in both material and manufacturing cost compare co wire bonding interconnect technology. Inversely, flip chip technology with chip flipped and attached to substrate provides a gap in...