Simulation and fabrication of micro magnetometer using flip-chip bonding technique

• Main Authors: Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
• Other Authors: Alfred, Rayner
• Format: Conference or Workshop Item
• Language: English; English
• Published: Springer Nature Singapore Pte Ltd. 2019
• Subjects: T Technology (General); TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
• Online Access: http://irep.iium.edu.my/73199/1/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer.pdf; http://irep.iium.edu.my/73199/7/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer%20using%20flip-chip%20bonding%20technique_scopus.pdf; http://irep.iium.edu.my/73199/; https://link.springer.com/chapter/10.1007/978-981-13-2622-6_48; https://doi.org/10.1007/978-981-13-2622-6

Magnetic field detection has been widely accepted in many applications such as military systems, outer space exploration and even in medical diagnosis and treatment. Low magnetic field detection is particularly important in tracking of magnetic markers in digestive tracks or blood vessels. The pr...