Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader

• Main Authors: Lim, V., Amin, N., Foong, C.S., Ahmad, I., Zaharim, A., Rasid, R., Jalar, A.
• Published: 2017
• Online Access: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5243

This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. Electroless nickel plating is used as a plating technique as it can form a uniform thickness of nickel layer onto the copper substrate. Catalytic activation proces...