Flip-chip bonding fabrication technique

• Main Authors: Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
• Format: Conference or Workshop Item
• Language: English; English
• Published: IOP Publishing 2017
• Subjects: T Technology (General); TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
• Online Access: http://irep.iium.edu.my/59213/1/ICOM%2717%20_%20IOP%20Published_%20Afif.pdf; http://irep.iium.edu.my/59213/12/59213_Flip-Chip%20Bonding%20Fabrication%20Technique_scopus.pdf; http://irep.iium.edu.my/59213/; http://iopscience.iop.org/article/10.1088/1757-899X/260/1/012005

Military systems, outer space exploration and even in medical diagnosis and treatment used magnetic field detection. Low magnetic field detection is particularly important in tracking of magnetic. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment....