In depth study of lead frame tape residuein quad flat non-leaded package

Purpose: Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to...

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Bibliographic Details
Main Authors: Nadaraja, S.K., Yap, B.K.
Format: Article
Language:English
Published: 2020
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