In depth study of lead frame tape residuein quad flat non-leaded package

Purpose: Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to...

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Main Authors: Nadaraja, S.K., Yap, B.K.
Format: Article
Language:English
Published: 2020
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spelling my.uniten.dspace-128092020-02-05T03:08:45Z In depth study of lead frame tape residuein quad flat non-leaded package Nadaraja, S.K. Yap, B.K. Purpose: Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it. Design/methodology/approach: An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength. Findings: Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape’s thermoplastic adhesive properties. Originality/value: This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution. © 2019, Emerald Publishing Limited. 2020-02-03T03:26:59Z 2020-02-03T03:26:59Z 2019 Article 10.1108/MI-12-2018-0077 en
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
language English
description Purpose: Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it. Design/methodology/approach: An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength. Findings: Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape’s thermoplastic adhesive properties. Originality/value: This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution. © 2019, Emerald Publishing Limited.
format Article
author Nadaraja, S.K.
Yap, B.K.
spellingShingle Nadaraja, S.K.
Yap, B.K.
In depth study of lead frame tape residuein quad flat non-leaded package
author_facet Nadaraja, S.K.
Yap, B.K.
author_sort Nadaraja, S.K.
title In depth study of lead frame tape residuein quad flat non-leaded package
title_short In depth study of lead frame tape residuein quad flat non-leaded package
title_full In depth study of lead frame tape residuein quad flat non-leaded package
title_fullStr In depth study of lead frame tape residuein quad flat non-leaded package
title_full_unstemmed In depth study of lead frame tape residuein quad flat non-leaded package
title_sort in depth study of lead frame tape residuein quad flat non-leaded package
publishDate 2020
_version_ 1662758772794195968
score 13.222552