Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

• المؤلفون الرئيسيون: Dele-Afolabi T.T., Ansari M.N.M., Azmah Hanim M.A., Oyekanmi A.A., Ojo-Kupoluyi O.J., Atiqah A.
• مؤلفون آخرون: 56225674500
• التنسيق: Review
• منشور في: Elsevier Editora Ltda 2024
• الموضوعات: Energy; ENImAg surface finish; Interlayer components; Intermetallic compounds; Rotary magnetic field; Sn-based solder; Electronics packaging; Finishing; Intermetallics; Lead-free solders; Microelectronics; Packaging materials; Reliability; Soldering; Temperature; Electronics products; Interlayer component; Intermetallics compounds; Magnetic-field; Sn-based solders; Solder joints; Surface finishes; Magnetic fields

The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electroni...