The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging

Recently, the attention toward CNT-composite solder (CCS) has increased remarkably due to numerous advantages. However, the electronic devices’ failure is still growing and has become an integral part of the countless product in the industrial market. These failures are mainly related to the reliabi...

Full description

Saved in:
Bibliographic Details
Main Author: Ahmad, Intan Fatihah
Format: Thesis
Language:English
English
Published: 2022
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/26873/1/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf
http://eprints.utem.edu.my/id/eprint/26873/2/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf
http://eprints.utem.edu.my/id/eprint/26873/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122194
Tags: Add Tag
No Tags, Be the first to tag this record!