Lead free solder joint thermal condition in semiconductor packaging
Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to p...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Science Publications
2010
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| Online Access: | http://psasir.upm.edu.my/id/eprint/15427/1/ajassp.2010.949.953.pdf http://psasir.upm.edu.my/id/eprint/15427/ http://thescipub.com/abstract/10.3844/ajassp.2010.949.953 |
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