Numerical investigation of heat transfer in plastic leaded chip carrier (PLCC) packages in in-line arrangement
Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a pr...
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| Main Authors: | , , , |
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| Format: | Non-Indexed Article |
| Language: | English |
| Published: |
Dialetique Publishers
2010
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| Online Access: | http://discol.umk.edu.my/id/eprint/7886/1/Journal%20of%20Modeling%2C%20Design%20and%20Management%20of%20Engineering%20Systems.pdf http://discol.umk.edu.my/id/eprint/7886/ |
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