The Effect of Trim and Form Process on the Plated Leads of IC Packages

• Main Author: Muhammad Saifuldin Bin Bakri, Muhammad Saifuldin
• Format: Final Year Project
• Language: English; English; English; English; English
• Published: Universiti Teknologi Petronas 2010
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://utpedia.utp.edu.my/1313/1/01_-_Front_page.pdf; http://utpedia.utp.edu.my/1313/2/02_-_Abstract%2C_ToC%2C_LoF%2C_Abb.pdf; http://utpedia.utp.edu.my/1313/3/03_-_Dissertation__Body_.pdf; http://utpedia.utp.edu.my/1313/4/04_-_Appendix_1.pdf; http://utpedia.utp.edu.my/1313/5/05_-_Appendix_2.pdf; http://utpedia.utp.edu.my/1313/

This dissertation presents the finding on the project “The Effect of Trim and Form Process on the Plated Leads of IC Packages”. This work was done in collaboration with IDS Electronics Sdn Bhd which is a semiconductor assembly house. One of the highest volume product in IDS is the SOT-23-3L EIAJ IC...