Uniformity of Plating Thickness of IC Packages at Various Locations on its Lead Frame

• Main Author: Farah Liyana Binti Ab. Ghani, Farah Liyana
• Format: Final Year Project
• Language: English
• Published: Universiti Teknologi Petronas 2010
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://utpedia.utp.edu.my/1460/1/Farah_Liyana.pdf; http://utpedia.utp.edu.my/1460/

This report outlines a project entitled ‘Uniformity of Plating Thickness of IC Packages at Various Locations on its Lead Frame’. The project is conducted with the collaboration of IDS Electronics Sdn Bhd, a company that offers semi conductor assemblies and services. IC package used in this study...