Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls
Solder joint strength on lead-free product is a reliability concern when subjected to the different environment stress in comparison to leaded product. Integrating a lead-free polymer core inside the solder ball may be a good strategy, where the polymer core could function as a stress buffer to diss...
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Main Authors: | Kar Y.B., Agileswari, Hui T.C., Talik N.A. |
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Other Authors: | 26649255900 |
Format: | Article |
Published: |
2023
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