Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls

Solder joint strength on lead-free product is a reliability concern when subjected to the different environment stress in comparison to leaded product. Integrating a lead-free polymer core inside the solder ball may be a good strategy, where the polymer core could function as a stress buffer to diss...

Full description

Saved in:
Bibliographic Details
Main Authors: Kar Y.B., Agileswari, Hui T.C., Talik N.A.
Other Authors: 26649255900
Format: Article
Published: 2023
Subjects:
IMC
SAC
Tags: Add Tag
No Tags, Be the first to tag this record!