Copper-filled electrically conductive adhesives with enhanced shear strength

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Bibliographic Details
Main Authors: Ho, Li Ngee, Dr., Hiroshi, Nishikawa
Other Authors: lnho@unimap.edu.my
Format: Article
Language:English
Published: ASM International 2015
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Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299
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