A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
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Main Authors: | Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al Bakri, Abdullah, Sandu, Andrei Victor, Norainiza, Saud, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., McDonald, Stuart D., Nogita, Kazuhiro |
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Other Authors: | arifanuar@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Syscom 18 SRL
2014
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/35751 |
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