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A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods

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Bibliographic Details
Main Authors: Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al Bakri, Abdullah, Sandu, Andrei Victor, Norainiza, Saud, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., McDonald, Stuart D., Nogita, Kazuhiro
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Syscom 18 SRL 2014
Subjects:
Intermetallics
Mechanical
Microstructure
Powder metallurgy
Solder
Wettability
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35751
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spelling my.unimap-357512014-06-20T08:29:20Z A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods Mohd Arif Anuar, Mohd Salleh Mohd Mustafa Al Bakri, Abdullah Sandu, Andrei Victor Norainiza, Saud Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. McDonald, Stuart D. Nogita, Kazuhiro arifanuar@unimap.edu.my mustafa_albakri@unimap.edu.my sav@tuiasi.ro norainiza@unimap.edu.my kamarudin@unimap.edu.my s.mcdonald1@uq.edu.au k.nogita@uq.edu.au Intermetallics Mechanical Microstructure Powder metallurgy Solder Wettability Link to publisher's homepage at http://syscom.ro/ The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting Sn-0.7Cu solder bulks. PM Sn-0.7Cu solder showed denser and finer Sn-grain structure, while cast Sn-0.7Cu showed larger Sn-rich dendrites with the presence of eutectic phase region. The mechanical performance of the solder bulk prepared with the PM technique was enhanced as it had higher microhardness value, UTS, and yield strength compared to the solder bulk prepared using the casting method. The solder wettability of the product was also increased using the PM method. Overall, the PM method can improve the mechanical and solderability properties of lead-free solder; therefore, it holds great potential as a new method for solder fabrication. 2014-06-20T08:29:20Z 2014-06-20T08:29:20Z 2013-07 Article Revista de Chimie vol. 64(7), 2013, pages 725-728 0034-7752 http://www.revistadechimie.ro/article_eng.asp?ID=3718 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35751 en Syscom 18 SRL
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Intermetallics
Mechanical
Microstructure
Powder metallurgy
Solder
Wettability
spellingShingle Intermetallics
Mechanical
Microstructure
Powder metallurgy
Solder
Wettability
Mohd Arif Anuar, Mohd Salleh
Mohd Mustafa Al Bakri, Abdullah
Sandu, Andrei Victor
Norainiza, Saud
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
McDonald, Stuart D.
Nogita, Kazuhiro
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
description Link to publisher's homepage at http://syscom.ro/
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Mohd Arif Anuar, Mohd Salleh
Mohd Mustafa Al Bakri, Abdullah
Sandu, Andrei Victor
Norainiza, Saud
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
McDonald, Stuart D.
Nogita, Kazuhiro
format Article
author Mohd Arif Anuar, Mohd Salleh
Mohd Mustafa Al Bakri, Abdullah
Sandu, Andrei Victor
Norainiza, Saud
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
McDonald, Stuart D.
Nogita, Kazuhiro
author_sort Mohd Arif Anuar, Mohd Salleh
title A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
title_short A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
title_full A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
title_fullStr A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
title_full_unstemmed A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
title_sort comparative study of solder properties of sn-0.7cu lead-free solder fabricated via the powder metallurgy and casting methods
publisher Syscom 18 SRL
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35751
_version_ 1643797895290290176
score 13.214268

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