Description: A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods

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Bibliographic Details
Main Authors:	Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al Bakri, Abdullah, Sandu, Andrei Victor, Norainiza, Saud, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., McDonald, Stuart D., Nogita, Kazuhiro
Other Authors:	arifanuar@unimap.edu.my
Format:	Article
Language:	English
Published:	Syscom 18 SRL 2014
Subjects:	Intermetallics Mechanical Microstructure Powder metallurgy Solder Wettability
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/35751
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