Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
Link to publisher's homepage at www.ttp.net/
Saved in:
Main Authors: | , , , , |
---|---|
Other Authors: | |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2011
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/16293 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|