An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite

• Main Authors: Norainiza, Saud, Rita, Mohd Said, Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, Mohd Izrul Izwan, Ramli, Norhayanti, Mohd Nasir
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: EDP Sciences 2020
• Subjects: Titanium oxide (TiO2); Solder
• Online Access: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170

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