Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
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Main Authors: | Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Mayappan, Ramani, Noor Farhani, Mohd Alui |
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Other Authors: | arifanuar@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838 |
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