Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints

• Main Authors: Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Mayappan, Ramani, Noor Farhani, Mohd Alui
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Subjects: Hardness; Lead-free composite solder; Recycled-Aluminium; Shear stress
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838

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